Plat cetak BGA STENSIL 0.12mm multiple holes 0.3 0.35 0.4 0.5 bga reballing stencil template for mobile phone bga chip repair

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Kota Asal Pengiriman : Kabupaten Bantul

Rp 120.000 Rp 40.000

Plat cetak BGA STENSIL 0.12mm multiple holes 0.3 0.35 0.4 0.5 bga reballing stencil template for mobile phone bga chip repair

In stock (can be backordered)

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Plat cetak BGA STENSIL 0.12mm multiple holes 0.3 0.35 0.4 0.5 bga reballing stencil template for mobile phone bga chip repair

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https://pbs.twimg.com/media/Db1iLcVVQAEEUUb.jpg

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Additional information

Weight 100 g

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